Wafer Bonding

Wafer size 150 and 200 mm

  • Bond aligning - EVG 620
  • Fusion bonding - EVG 5201S and EVG (non-IC materials)
  • Acoustic Microscope – Sonix HS3000
  • Alignment accuracy verification tool – Suss MicroTec
  • DSM8 Wafer thinning - Strasbaugh 7AF
  • Polishing and planarization - Strasbaugh 6DS-SP

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For a closer desciption of process equipment click here. Or visit our equipment booking system LIMS.