Surface and SOI MEMS

  • soiandmems2.jpgDeep silicon etching - Aviza Omega i2L and STS ASE

  • CO2 supercritical dryer - BalTec CPD 408

  • HF Vapour release etcher - Primaxx

  • Atomic layer deposition of Al2O3 and TiO2 and their nanolaminates - Picosun SUNALE R-150B

  • Wafer thinning -Strasbaugh 7AF backgrinder

  • Polishing and planarization - Strasbaugh 6DS-SP CMP

 

 

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For a closer desciption of process equipment click here. Or visit our equipment booking system LIMS.