CMOS and BiCMOS

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0,6 µm technology; most applications > 0,8µm

  • i-line stepper - Canon FPA 2500i3
  • Resist/development track AIO Duna 700
  • Etchers for silicon oxide,nitride,metals - LAM 4520/4420/9600
  • Furnace processes: oxidation, LTO, TEOS, Nitride, doped and undoped polysilicon - 2 Centrotherm furnace stacks
  • Sputtering: AlSi, Mo, TiW, Si - Provac LLS 801
  • PECVD: Silicon oxide and nitride, incl. TEOS-process
  • Wet benches for cleaning and etching - Stangl
  • Medium current ion implanter - Eaton NV 8200-P

For a closer desciption of process equipment click here. Or visit our equipment booking system LIMS.