Advanced Micropackaging


  • Lithography - Suss MA200 aligner, ACS 200 resist track
  • Sputtering of TiW and Cu - TEL Mark IV
  • Spray etching - Laurell spinners
  • Plating - several plating tools, incl Cu, Ni, SnAg from RENA; SnPb, SnBi and Ni from PM Plast
  • Dicing - Disco DFD 651 and Loadpoint uAce-352
  • Flip-chip bonding - 2 FC150 bonders (Suss Microtec)



For a closer desciption of process equipment click here. Or visit our equipment booking system LIMS.