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RENA Ni PLATING MODULE, ELECTROPLATING SYSTEM (060631-L-Ni), (F519A)

Contact Person:

Hannele Heikkinen
Hannele.Heikkinen(at)vtt.fi
+358207226656

Year of Manufacture and Installation:

2007 / 2007

Description:

Electroplating system for nickel growing.

Key Features and Accessories:

Electrolyte bath contains mainly nickel sulfamate and boric acid
Electrolyte flow up to 35 l/min 
Electrolyte temperature: RT to about 50 °C 
Wafer rotating: up to 50 rpm
Only DC plating possibility. 
When plating is done on wafers with photoresist: about 4 mm EBR is needed 

Key Specifications:

-

Substrate Size:

100, 125, 150 and 200 mm wafers

Allowed Materials:

Non-IC metal wafers

Forbidden Materials:

-

Availability and Cost:

Availability and cost: N

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