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PLATING MODULE SnPb_EUTECT, ELECTROPLATING SYSTEM, (F509)

Contact Person:

Hannele Heikkinen
Hannele.Heikkinen(at)vtt.fi
+358207226656

Year of Manufacture and Installation:

- / -

Description:

Electroplating system for eutectic Sn-Pb growing.

Key Features and Accessories:

Plating bath contains mainly methane sulfonic acid, tin(II) methane sulfonate and lead methane sulfonate.
Electrolyte temperature: RT 
No wafer rotating. Plating is done on resist patterned wafers

Key Specifications:

-

Substrate Size:

100, 125, 150 and 200 mm wafers

Allowed Materials:

Non-IC metal wafers

Forbidden Materials:

-

Availability and Cost:

Availability and cost: N

Name, Model and Manufacturer:

Plating module SnPb_eutect,
Electroplating system,
PM Plast Ab

Location:

M2, F5/b Plating