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In PLATING MODULE, ELECTROPLATING SYSTEM, (F504)

Year of Manufacture and Installation:

 

Description:

Electroplating system for indium growing.

Key Features and Accessories:

Indium sulfamate plating bath.
Electrolyte temperature: RT 
No wafer rotating.
Plating is done on resist patterned wafers. 

Key Specifications:

-

Substrate Size:

100, 125, 150 and 200 mm wafers

Allowed Materials:

Non-IC metal wafers

Forbidden Materials:

-

Availability and Cost:

Availability and cost: N

Name, Model and Manufacturer:

In plating module,
Electroplating system,
PM Plast Ab

Location:

M2, F5/b Plating