Nanofab Equipment
Micronova Nanofab equipment booking system:
http://217.16.193.243/LimsMicronova/
Equipment:
Annealing:
Back-end Processes:
- DICING SAW
- WIRE BONDER, DELVOTEC 6119
- WIRE BONDER, DELVOTEC 53BDA
- OVEN, LCD1-51NV-3STD , (F02)
- PARYLENE DEPOSITION SYSTEM, PSD 2010 LABCOATER2, (F07)
Characterization:
- 4-POINT PROBE
- DESKTOP SEM WITH EDX
- DUAL FOCUSED BEAM SYSTEM WITH EDX, FEI HELIOS
- ELLIPSOMETER, PLASMOS SD 2300
- HALL MEASUREMENT SYSTEM
- HIGH TEMPERATURE KELVIN SCANNER
- OPTICAL MICROSCOPE, ZEISS OPTON
- OPTICAL MICROSCOPE, ZEISS OPTON
- OPTICAL MICROSCOPE, LABORLUX
- REFLECTOMETER, ZEISS OPTON
- PROFILOMETER, DEKTAK^3
- PROFILOMETER, TENCOR ALPHA STEP 200
- SCANNING ELECTRON MICROSCOPE, ZEISS DSM-950
- SCANNING ELECTRON MICROSCOPE, ZEISS SUPRA 40
- SCANNING PROBE MICROSCOPE, NTEGRA
- SEMIAUTOMATIC PROBE STATION, SUSS PA150
- SPECTROSCOPIC ELLIPSOMETER, SE 805
- SEM / EDX, LEO1560, (A05)
- OPTICAL PROFILOMETER, WYKO SP3000W, (F101)
- SEM,LEO SUPRA-35, (G01)
- AFM, DIMENSION 3100, (H01)
- SPECTROPHOTOMETER, FILMTEK 4000, (H02)
CVD & ALD:
- ATOMIC LAYER DEPOSITION (ALD), BENEQ TFS-500
- LPCVD POLYSILICON FURNACE, CENTROTHERM CVD3
- OPT PECVD, PLASMALAB 80 PLUS
- ALD REACTOR, SUNALE R-150B, (B12)
Dry Etching:
- INDUCTIVELY COUPLED PLASMA ETCHER, PLASMALAB 100
- REACTIVE ION ETCHER, PLASMALAB 80
- PLASMA REACTOR, TEPLA
- SILICON DRIE ETCHER (AVIZA), OMEGA I2L, (B01)
- SILICON ICP ETCHER (STS), STS-ASE, (B02)
- OXIDE ETCHER, 4520, (B03)
- METAL ETCHER, 9600 TCP, (B05)
- BCB ETCHER, AUTOETCHER 590 B, (F05)
Electrochemical Deposition:
- Ni PLATING MODULE, ELECTROPLATING SYSTEM, (F503)
- In PLATING MODULE, ELECTROPLATING SYSTEM, (F504)
- PLATING MODULE SnPb_EUTECT, ELECTROPLATING SYSTEM, (F509)
- Ni PLATING MODULE BUMP, ELECTROPLATING SYSTEM, (F514)
- RENA COPPER VIA, ELECTROPLATING SYSTEM (060303-L-Cu via), (F518A)
- RENA COPPER WIRE, ELECTROPLATING SYSTEM (060303-R-Cu wire), (F518B)
- RENA Ni PLATING MODULE, ELECTROPLATING SYSTEM (060631-L-Ni), (F519A)
- RENA SnAg PLATING, ELECTROPLATING SYSTEM (060631-R-SnAg), (F519B)
Epitaxial Growth:
Furnace Processes:
Ion Implantation:
Lithography:
- MASK ALIGNER, "ELVIS"
- MASK ALIGNER, "MAURI ANTERO"
- MASK ALIGNER, SUSS MJB3
- MASK ALIGNER, LOMO
- OVENS, MEMMERT
- WAFER STEPPER, CANON FPA-2500i3, (A01)
- MASK ALIGNER, SUSS MA150, (A02)
- DEVELOPER TRACK CONVAC, CEA-M-6000, (A03)
- RESIST TRACK CONVAC, CBA-M-6000, (A04)
- RESIST TRACK AIO COAT/DEVELOP, DUNA700, (A09)
- PRIMER OVEN, YES-3, (A10)
- MANUAL SPINNER, LSM200, (A11)
- RESIST OVEN 1, UFE400, (A12)
- RESIST OVEN 2, UFE400, (A13)
- RESIST OVEN 3, UFE400, (A14)
- UV PHOTOSTABILIZER, M150PC, (B06)
- RESIST TRACK, M6000, (F01)
- SPINNER 6 INCH, WS-400-6NPP-IND HFP SPINNER ETCHER, (F208)
- SPINNER 8 INCH, EDC1-100-8NPP SPINNER ETCHER, (F209)
Nanostructuring:
Physical Vapour Deposition:
- ELECTRON-BEAM EVAPORATOR, IM9912
- ELECTRON GUN EVAPORATOR, VARIAN
- ELECTRON GUN - RESISTIVE EVAPORATOR, EDWARDS
- OPT SPUTTER, PLASMALAB SYSTEM 400
- RF SPUTTERING SYSTEM, EDWARDS + LEYBOLD
- SEM SAMPLE SPUTTER COATER
- SPUTTERING SYSTEM, PROVAC LLS801, (E01)
- VAPOR GENERATION SYSTEM
Wafer Bonding:
Wet Processes:
- ALUMINUM ETCH
- RCA CLEANING
- RINSER/DRYER, SEMITOOL
- RINSER/DRYER
- SILICON ETCHING IN TMAH
- SPINNER FOR SOG
- WET BENCH, BCB, (F03)
- SPIN RINSE DRIER,VERTEQ SUPERCLEAN 1600-34, (F04)
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