Nanofab Equipment
Equipment:
Annealing:
Back-end Processes:
Characterization:
- 4-POINT PROBE
- DESKTOP SEM WITH EDX
- DUAL FOCUSED BEAM SYSTEM WITH EDX, FEI HELIOS
- ELLIPSOMETER, PLASMOS SD 2300
- HALL MEASUREMENT SYSTEM
- HIGH TEMPERATURE KELVIN SCANNER
- OPTICAL MICROSCOPE, ZEISS OPTON
- OPTICAL MICROSCOPE, ZEISS OPTON
- OPTICAL MICROSCOPE, LABORLUX
- REFLECTOMETER, ZEISS OPTON
- PROFILOMETER, DEKTAK^3
- PROFILOMETER, TENCOR ALPHA STEP 200
- SCANNING ELECTRON MICROSCOPE, ZEISS DSM-950
- SCANNING ELECTRON MICROSCOPE, ZEISS SUPRA 40
- SCANNING PROBE MICROSCOPE, NTEGRA
- SEMIAUTOMATIC PROBE STATION, SUSS PA150
- SPECTROSCOPIC ELLIPSOMETER, SE 805
CVD & ALD:
- ATOMIC LAYER DEPOSITION (ALD), BENEQ TFS-500
- LPCVD POLYSILICON FURNACE, CENTROTHERM CVD3
- OPT PECVD, PLASMALAB 80 PLUS
Dry Etching:
- INDUCTIVELY COUPLED PLASMA ETCHER, PLASMALAB 100
- REACTIVE ION ETCHER, PLASMALAB 80
- PLASMA REACTOR, TEPLA
Electrochemical Deposition:
Epitaxial Growth:
Furnace Processes:
Ion Implantation:
Lithography:
- MASK ALIGNER, "ELVIS"
- MASK ALIGNER, "MAURI ANTERO"
- MASK ALIGNER, SUSS MJB3
- MASK ALIGNER, LOMO
- OVENS, MEMMERT
Nanostructuring:
Physical Vapour Deposition:
- ELECTRON-BEAM EVAPORATOR, IM9912
- ELECTRON GUN EVAPORATOR, VARIAN
- ELECTRON GUN - RESISTIVE EVAPORATOR, EDWARDS
- OPT SPUTTER, PLASMALAB SYSTEM 400
- RF SPUTTERING SYSTEM, EDWARDS + LEYBOLD
- SEM SAMPLE SPUTTER COATER
Wafer Bonding:
Wet Processes:
- ALUMINUM ETCH
- RCA CLEANING
- RINSER/DRYER, SEMITOOL
- RINSER/DRYER
- SILICON ETCHING IN TMAH
- SPINNER FOR SOG
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