Microsystems
Sensors applications
Micronova microsystems/MEMS research spans over all major technologies:
silicon, glass, polymers and metals; bulk, SOI and surface micromachining,
and a wealth of applications, mostly in sensors and fluidics. For MEMS-sensors, see "Sensors and Detectors"
Hannu Kattelus, hannu.kattelus@vtt.fi, tel. +358 20 722 6319
Ilkka Tittonen, ilkka.tittonen@tkk.fi, tel. +358 9 451 2287
SOI and Surface Micromechanics
SOI and polysilicon-based MEMS make use of silicon dioxide as the sacrificial layer. We have developed a number of devices based on these technologies, ranging from micromechanics to optics, RF-MEMS and BioMEMS. The fabrication and development of fabrication processes is carried out mainly by VTT.
Hannu Kattelus, hannu.kattelus@vtt.fi, tel. +358 20 722 6319
Amorphous Metal Micromachining
Amorphous metal micromachining is a low thermal budget process where polymeric sacrificial layers, such as photoresist, are used. The research is carried out at VTT.
Hannu Kattelus, hannu.kattelus@vtt.fi, tel. +358 20 722 6319
Wafer Engineering
Wafer engineering at Micronova covers development and small-scale fabrication of tailored wafers and wafer level encapsulation methods for MEMS. We are involved in bulk silicon, SOI, pre-processed SOI and layer transfer techniques using wafer bonding, chemical-mechanical polishing and wafer thinning techniques. Also, wafer scale packaging techniques together with through-wafer interconnects are developed.
Kimmo Henttinen, kimmo.henttinen@vtt.fi, tel. +358 20 722 6310
RF-MEMS
In the field of RF-MEMS, devices such as FBARs, 13 MHz silicon microresonators and reference oscillators made thereof, varactors, switches, mm-wave tuners, phase shifters, and power sensors have been made. Work is done both in TKK Micro and Quantum Systems and at VTT.
Aarne Oja, aarne.oja@vtt.fi, tel. +358 20 722 6526
Ilkka Tittonen, ilkka.tittonen@tkk.fi, tel. +358 9 451 2287
High-Q Resonators
We have the expertise to fabricate MEMS oscillators, which challenge the bulky quartz crystals used in wireless communication applications today. The oscillators have a very low drift (0.01 ppm per month) and the phase noise figures satisfy the stringent GSM specifications. The microresonators are fabricated using SOI technology.
Antti Jaakkola, antti.jaakkola@vtt.fi, tel. +358 20 722 6541
Ilkka Tittonen, ilkka.tittonen@tkk.fi, tel. +358 9 451 2287
MEMS-IC Integration
Monolithical integration of MEMS and CMOS is possible using the innovative Plug-up process. We have demonstrated CMOS ICs on a same substrate with SOI capacitive pressure sensors or silicon microresonators.
Jyrki Kiihamäki, jyrki.kiihamaki@vtt.fi, tel. +358 20 722 6306
Microfabrication
We study silicon, glass and polymer materials and fabrication techniques for MEMS and microfluidics. Topics included patterning (litography, imprinting, casting), etching (anisotropic wet, DRIE, electrochemical), thin films (ALD, CVD) and bonding (adhesive, anodic and fusion). We also work on nanoporous materials (silicon, alumina) for fluidics, nanobiotechnology and templated growth.
Microfabrication Group, Sami Franssila, sami.franssila@tkk.fi, tel. +358 9 451 2332
Microfluidics and BioMEMS
We work on fluidic, chemical and thermal systems with applications in mass spectrometry, protein analysis and sample treatment. We fabricate BioMEMS devices in silicon and glass, e.g. PCR reactor, SPE/CE chips, capillary self-filling fluidic networks. We are also involved in fluidic simulations, fluidic interconnects to the macroworld and fluorescence detection (LIF).
Ari Hokkanen, ari.hokkanen@vtt.fi, tel. + 358 20 722
4525
Microfabrication Group, Sami Franssila, sami.franssila@tkk.fi, tel. +358 9 451 2332
Micropackaging
Micropackaging efforts are geared towards high-density flip chip techniques
for sensor and detector packaging.
Jaakko Salonen, jaakko.salonen@vtt.fi, tel. +358 20 722 4784
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